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MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Welding Flux for Mobile Phone Motherboard Repair

MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Welding Flux for Mobile Phone Motherboard Repair

Regular price $8.10
Regular price $0.00 Sale price $8.10
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Color

SPECIFICATIONS

Usage: Circuit Board Soldering Repair

Type: XG-50 , 35g

Particle Size: 1-10μm

Origin: CN(Origin)

Model Number: MECHANIC Solder Paste XG-50

Certification: CE

Brand Name: SFDER

Application: Mobile Phone Motherboard Repair

MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Welding Flux for Mobile Phone Motherboard Repair
 
 
Product Features:
  • 100% brand new and high quality.
  • Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on good soldering and welding tool.
  • Unleaded MECHANIC BGA Solder Flux Paste Soldering Tin Cream Professional for BGA Soldering Iron Station.
  • solder paste, 183 ℃, the degree of melting point, easy welding, easy molding.
 
Product Specifications:
  • Material: Plastic+solder paste.
  • Color: As picture shown
  • Type: XG-50 , 35g
  • Microns: 25-45um.
  • Application: for BGA motherboard soldering iron station flux cream.
  • Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
  • Hi-Preformance.
  • Storage Condition:0-10°c.
 
Note:
  • Harmful by inhalation and if swallowed.
  • Danger of cumulative effects.
  • Keep away from food,drink and animal feeding stuffs.
  • When using do not eat,Drink or smoke.
  • Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
  • Store container welll closed and cool.






















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